XCZU3CG-L1SFVA625I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 625-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 625 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B625 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 180 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC CG.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 180 I/Os in total.A power supply with a 0.72V rating is recommended.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 0.698V of power.Having 625 terminations in total makes system on a chip possible.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Moreover, this SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY as its additional features.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU3CG-L1SFVA625I System On Chip (SoC) applications.
- Cyberphysical system-on-chip
- Vending machines
- Mobile computing
- Medical Pressure
- Automotive gateway
- Temperature Sensors
- Functional safety for critical applications in the automotive
- Special Issue Editors
- Level
- Central alarm system
