XCZU3CG-L2SFVA625E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 625-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 625 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B625 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 180 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC CG is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 154K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 180 I/Os.A 0.72V power supply should be used.In the SoCs wireless, high voltages above 0.742V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 0.698V.It is really beneficial to have system on a chip since there are 625 terminations in total.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU3CG-L2SFVA625E System On Chip (SoC) applications.
- RISC-V
- Sports
- Apple smart watch
- Medical
- Communication interfaces ( I2C, SPI )
- Medical
- Networked Media Encode/Decode
- High-end PLC
- Print Special Issue Flyer
- Robotics
