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XCZU4CG-2SFVC784E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU4CG-2SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 769
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 784-BFBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 252
Speed 533MHz, 1.3GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.Manufacturer assigns package 784-BFBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.The Zynq? UltraScale+? MPSoC CG series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.252 I/Os in total are included in this SoC part.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU4CG-2SFVC784E System On Chip (SoC) applications.

  • Central inverter
  • USB hard disk enclosure
  • Communication network-on-Chip (cNoC)
  • External USB hard disk/SSD
  • Wireless networking
  • Networked sensors
  • Wireless sensor networks
  • Mobile computing
  • Networked Media Encode/Decode
  • sequence controllers

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