XCZU5CG-1SFVC784I
| Parameters | |
|---|---|
| Package / Case | 784-BFBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 252 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 256K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 252 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-1SFVC784I System On Chip (SoC) applications.
- Networked sensors
- Microcontroller based SoC ( RISC-V, ARM)
- Functional safety for critical applications in the aerospace
- Special Issue Information
- Networked Media Encode/Decode
- Transmitters
- Microprocessors
- Industrial AC-DC
- Digital Signal Processing
- Body control module
