XCZU5CG-2SFVC784E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 784-BFBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 252 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.This system on a chip is packaged as 784-BFBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 252 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-2SFVC784E System On Chip (SoC) applications.
- Special Issue Editors
- Vending machines
- Sensor network-on-chip (sNoC)
- String inverter
- Automotive
- Remote control
- Communication interfaces ( I2C, SPI )
- Wireless networking
- Optical drive
- Smartphone accessories
