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XCZU5EG-L2FBVB900E

900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU5EG-L2FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 251
  • Description: 900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O0.72V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 256K+ Logic Cells.Housed in the state-of-art Tray package.As a whole, this SoC part includes 204 I/Os.A 0.72V power supply is recommended.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 0.698V.In total, there are 900 terminations, which makes system on a chip possible.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU5EG-L2FBVB900E System On Chip (SoC) applications.

  • Healthcare
  • Wireless sensor networks
  • Apple smart watch
  • Self-aware system-on-chip (SoC)
  • Vending machines
  • Smartphones
  • Central alarm system
  • Flow Sensors
  • Industrial sectors
  • AC-input BLDC motor drive

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