XCZU5EV-1FBVB900E
| Parameters | |
|---|---|
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 204 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EV series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 204 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EV-1FBVB900E System On Chip (SoC) applications.
- USB hard disk enclosure
- Industrial
- Wireless networking
- ARM processors
- Central inverter
- Industrial automation devices
- Servo drive control module
- Level
- Communication network-on-Chip (cNoC)
- Avionics
