Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EV |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
204 |
Speed |
533MHz, 600MHz, 1.3GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC EV is the series in which this system on chip SoC falls under.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 204 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EV-2FBVB900I System On Chip (SoC) applications.
- Three phase UPS
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