XCZU6CG-L1FFVC900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC CG is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part is comprised of 204 inputs and outputs.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.This SoC system on a chip can run on a power supply that is at least 0.698V.system on a chip benefits from 900 terminations.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU6CG-L1FFVC900I System On Chip (SoC) applications.
- Communication network-on-Chip (cNoC)
- Mobile computing
- Industrial sectors
- RISC-V
- Communication interfaces ( I2C, SPI )
- String inverter
- Networked sensors
- Cyber security for critical applications in the aerospace
- Mobile market
- ARM support modules
