Parameters |
Factory Lead Time |
1 Week |
Package / Case |
1156-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC CG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.85V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
R-PBGA-B1156 |
Supply Voltage-Max (Vsup) |
0.876V |
Supply Voltage-Min (Vsup) |
0.825V |
Number of I/O |
360 |
Speed |
533MHz, 1.3GHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq? UltraScale+? MPSoC CG series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.360 I/Os in total are included in this SoC part.A power supply with a 0.85V rating is recommended.There are voltages higher than 0.876V that should be avoided when using the SoCs wireless.It can feed on a power supply of at least 0.825V.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU7CG-2FFVC1156I System On Chip (SoC) applications.
- Deep learning hardware
- Automated sorting equipment
- Special Issue Editors
- Body control module
- Video Imaging
- Automotive
- High-end PLC
- Published Paper
- Medical Pressure
- Medical