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XCZU7CG-2FFVC1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 360 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU7CG-2FFVC1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 909
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 360 I/O0.85V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1156-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1156
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 360
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq? UltraScale+? MPSoC CG series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.360 I/Os in total are included in this SoC part.A power supply with a 0.85V rating is recommended.There are voltages higher than 0.876V that should be avoided when using the SoCs wireless.It can feed on a power supply of at least 0.825V.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU7CG-2FFVC1156I System On Chip (SoC) applications.

  • Deep learning hardware
  • Automated sorting equipment
  • Special Issue Editors
  • Body control module
  • Video Imaging
  • Automotive
  • High-end PLC
  • Published Paper
  • Medical Pressure
  • Medical

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