Parameters |
Factory Lead Time |
1 Week |
Package / Case |
1517-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
464 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 1517-BBGA, FCBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells together.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 464 I/Os in total.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-1FFVF1517I System On Chip (SoC) applications.
- Samsung galaxy gear
- Vending machines
- Level
- Cyberphysical system-on-chip
- Industrial automation devices
- Servo drive control module
- Automated sorting equipment
- Healthcare
- Central alarm system
- ARM processors