XCZU7EG-L2FBVB900E
| Parameters | |
|---|---|
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 204.It is recommended to use a 0.72V power supply.For the SoCs wireless, a voltage higher than 0.742V is considered unsafe.If it has at least a 0.698V volt power supply, it can work fine.In total, there are 900 terminations, which makes system on a chip possible.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU7EG-L2FBVB900E System On Chip (SoC) applications.
- Central inverter
- Cyberphysical system-on-chip
- Networked Media Encode/Decode
- Apple smart watch
- Industrial Pressure
- Fitness
- DC-input BLDC motor drive
- Smart appliances
- String inverter
- USB hard disk enclosure
