Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EV |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
900 |
Additional Feature |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.72V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
R-PBGA-B900 |
Supply Voltage-Max (Vsup) |
0.742V |
Supply Voltage-Min (Vsup) |
0.698V |
Number of I/O |
204 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq? UltraScale+? MPSoC EV series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells together.There is a state-of-the-art Tray package that houses this SoC system on a chip.Total I/Os on this SoC part are 204.A 0.72V power supply should be used.In the SoCs wireless, voltages above 0.742V are considered unsafe.Power supplies of at least 0.698V are required.There are 900 terminations in total and that really benefits system on a chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Furthermore, this SoC processor also incorporates additional features similar to ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY which are available on other SoC processors also.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU7EV-L1FBVB900I System On Chip (SoC) applications.
- Personal Computers
- Automated sorting equipment
- Medical Pressure
- Apple smart watch
- Keyboard
- Deep learning hardware
- Fitness
- Self-aware system-on-chip (SoC)
- Flow Sensors
- Three phase UPS