Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Series |
Zynq® UltraScale+™ MPSoC CG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of I/O |
204 |
Speed |
533MHz, 1.3GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.204 I/Os are included in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9CG-2FFVC900I System On Chip (SoC) applications.
- Industrial automation devices
- Mobile computing
- Temperature Sensors
- Apple smart watch
- Medical Pressure
- Efficient hardware for training of neural networks
- Three phase UPS
- Networked sensors
- ARM processors
- Mobile market