Be Semiconductor Industries

Introducing the cutting-edge technology of Be Semiconductor Industries (Besi), a global leader in advanced semiconductor packaging and assembly solutions. Our innovative products are designed to meet the stringent demands of the rapidly evolving semiconductor industry. We proudly present a comprehensive portfolio of solutions, empowering semiconductor manufacturers to maximize performance, reliability, and cost-effectiveness. Our packaging solutions cater to various technology nodes, including flip-chip, leadframe, and advanced module platforms, bringing unmatched flexibility and scalability to our customers. With a relentless commitment to excellence, we prioritize the needs of our customers, striving to create tailored products and services that optimize their production processes. Our state-of-the-art manufacturing facilities and advanced R&D capabilities ensure that we stay at the forefront of technological advancements, enabling us to anticipate market trends and deliver cutting-edge solutions. Experience the future of semiconductor packaging and assembly with Besi. Join us as we redefine industry standards, enable next-generation technologies, and drive forward the digital revolution. Together, let us build a better, more connected world.