08-350000-10-HT
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Number of Pins | 8 |
| Housing Material | POLYAMIDE |
| Contact Material - Post | Brass |
| Board Material | Polyimide (PI) |
| Published | 2006 |
| Series | Correct-A-Chip® 350000 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Rows | 2 |
| Contact Finish - Mating | Tin |
| Pitch - Mating | 0.050 1.27mm |
| Lead Pitch | 2.54mm |
| Number of Contacts | 8 |
| Contact Finish - Post | Tin-Lead |
| Device Socket Type | IC SOCKET |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Convert From (Adapter End) | SOIC |
| Convert To (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
