08-350000-11-RC-P
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Through Hole |
| Package / Case | SOIC |
| Number of Pins | 8 |
| Material | FR4 Epoxy Glass |
| Package Accepted | SOIC |
| Published | 2008 |
| Series | Correct-A-Chip® 350000 |
| Size / Dimension | 0.800Lx0.460W 20.32mmx11.68mm |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Number of Positions | 8 |
| Pitch | 0.050 1.27mm |
| Lead Length | 3.175mm |
| Proto Board Type | SMD to DIP |
| Board Thickness | 0.062 1.57mm 1/16 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
