10018783-10100TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 36 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Lead Pitch | 2.54mm |
| Number of Contacts | 36 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 25mm |
| Width | 7.4mm |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-10100TLF Overview
Packaging was conducted in accordance with Tray's specifications.You should mount it type Through Hole.A connector socket Cantilever is used for connecting the device.Board Guide, Locking Ramp features are available on the device.The HPCE? indicates the series number of the device.An operating temperature of 85°C°C provides stable performance.In order to ensure their reliability, they require a minimum working temperature of -55°C degrees Celsius.
10018783-10100TLF Features
HPCE? series
10018783-10100TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10100TLF Edgeboard Connectors applications.
- Displaying
- Smart antenna systems
- AC motor control
- Automotive
- Communication test equipment
- Transducer
- Digital signal processing
- Multiplexed Data Acquisition Systems
- Digital beam-forming systems for ultrasound
- Spectrum Analysis
