Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Contact Plating |
Gold |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Housing Material |
Nylon |
Material - Insulation |
Polyamide (PA), Nylon, Glass Filled |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Series |
HPCE® |
Feature |
Board Guide, Locking Ramp |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder, Staggered |
Connector Type |
Cantilever |
Number of Positions |
36 |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-55°C |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Contact Type |
Cantilever |
Pitch |
0.039 1.00mm |
Orientation |
Straight |
Current Rating |
1.1A |
Contact Finish |
Gold |
Voltage - Rated AC |
300V |
Lead Pitch |
2.54mm |
Number of Contacts |
36 |
Housing Color |
Black |
Card Type |
PCI Express™ |
Read Out |
Dual |
Insulation Resistance |
1GOhm |
Max Voltage Rating (AC) |
300V |
Length |
25mm |
Width |
7.4mm |
Contact Finish Thickness |
15.0μin 0.38μm |
Card Thickness |
0.062 1.57mm |
Board Thickness |
2.36mm |
RoHS Status |
RoHS Compliant |
Flammability Rating |
UL94 V-0 |
Lead Free |
Lead Free |
10018783-10110TLF Overview
Packaging was conducted in accordance with Tray's specifications.It is recommended that you mount the device with mounting type Through Hole.The device is connected with the connector socket Cantilever.Board Guide, Locking Ramp features are on this device.HPCE? shows the device's series.It's stable at 85°C°C.Ensure that it works at a minimum temperature of -55°C degrees Celsius to ensure its reliability.
10018783-10110TLF Features
HPCE? series
10018783-10110TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10110TLF Edgeboard Connectors applications.
- Automotive
- Displaying
- Digital signal processing
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- TD-SCDMA, WiMAX
- Industrial Process Control
- Battery Operated Systems
- Transducer
- Instrumentation and test equipment
- Smart antenna systems