10018783-10210TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 36 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 36 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 25mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-10210TLF Overview
The material was packaged according to Tray's specs.It is recommended that you mount the device with mounting type Through Hole.Connecting the device is accomplished by using connector socket Cantilever.This device is equipped with Board Guide, Locking Ramp features.HPCE? means it's a series device.The maximum operating temperature is 85°C°C for stability.As a minimum, it must be operated at a temperature of -55°C degrees Celsius.
10018783-10210TLF Features
HPCE? series
10018783-10210TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10210TLF Edgeboard Connectors applications.
- Broadband data applications
- Music recording
- Music reproduction technology
- Industrial Process Control
- Microcontrollers.
- Micro and pico cell systems, software radios
- Multicarrier, multimode digital receivers
- TD-SCDMA, WiMAX
- Automotive
- Wireless and wired broadband communications
