Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Contact Plating |
Gold |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Housing Material |
Nylon |
Material - Insulation |
Polyamide (PA), Nylon, Glass Filled |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Series |
HPCE® |
Feature |
Board Lock, Locking Ramp |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder, Staggered |
Connector Type |
Cantilever |
Number of Positions |
98 |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-55°C |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Contact Type |
Cantilever |
Pitch |
0.039 1.00mm |
Orientation |
Straight |
Current Rating |
1.1A |
Contact Finish |
Gold |
Voltage - Rated AC |
300V |
Number of Contacts |
98 |
Housing Color |
Black |
Contact Resistance |
30mOhm |
Card Type |
PCI Express™ |
Read Out |
Dual |
Insulation Resistance |
1GOhm |
Max Voltage Rating (AC) |
300V |
Length |
56mm |
Width |
7.4mm |
Contact Finish Thickness |
30.0μin 0.76μm |
Card Thickness |
0.062 1.57mm |
Board Thickness |
1.56mm |
RoHS Status |
RoHS Compliant |
Flammability Rating |
UL94 V-0 |
Lead Free |
Lead Free |
10018783-11002TLF Overview
It was packaged based on Tray's specs.The mounting type Through Hole is recommended.Connecting the device uses connector socket Cantilever.There are Board Lock, Locking Ramp features on this device.HPCE? tells you what series the device is.This can be achieved by maintaining a maximum operating temperature of 85°C°C.For reliability, it needs to be at -55°C degrees Celsius.
10018783-11002TLF Features
HPCE? series
10018783-11002TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11002TLF Edgeboard Connectors applications.
- Cell Phones
- Automotive
- Medical Instrumentation and medical imaging
- Communication test equipment
- Audio/Video devices
- 3-phase power control
- 4-channel data acquisition
- High Speed Data Acquisition for PCs
- Scientific instruments.
- Rotary encoder