10018783-11210TLF
| Parameters | |
|---|---|
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 36 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 25mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Lock, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 36 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
10018783-11210TLF Overview
Tray wanted the material packaged as per his specs.It is recommended to mount the device using type Through Hole.Devices are connected through connector sockets Cantilever.There are Board Lock, Locking Ramp features on this device.HPCE? means it's a series device.Operating at a maximum temperature of 85°C°C ensures stable performance.A minimum working temperature of -55°C degrees Celsius is required to ensure its reliability.
10018783-11210TLF Features
HPCE? series
10018783-11210TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11210TLF Edgeboard Connectors applications.
- Multicarrier, multimode digital receivers
- Micro and pico cell systems, software radios
- Digital signal processing
- Uninterrupted Power Supplies
- Imaging Systems
- Medical Instrumentation and medical imaging
- High Speed Data Acquisition for PCs
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Music reproduction technology
- Automotive
