10018783-12201TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 64 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Number of Positions/Bay/Row | 11; 21 |
| Max Voltage Rating (AC) | 300V |
| Length | 39mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-12201TLF Overview
In accordance with Tray's specifications, the material was packaged.Mounting type Through Hole is recommended.Using the connector socket Cantilever is how the device is connected.This device has Board Guide, Locking Ramp features.HPCE? indicates that the device belongs to the series.Keeping the maximum operating temperature at [0°C] facilitates stable operation.Ensure its reliability by working at a minimum temperature of -55°C degrees Celsius.
10018783-12201TLF Features
HPCE? series
10018783-12201TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-12201TLF Edgeboard Connectors applications.
- Music recording
- Battery Operated Systems
- AC motor control
- Digital signal processing
- Data Acquisition Systems
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Microcontrollers.
- Imaging Systems
- In-building wireless telephony
- Communications
