10CL006YE144C8G
| Parameters | |
|---|---|
| Number of Terminations | 144 |
| Voltage - Supply | 1.2V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PQFP-G144 |
| Number of I/O | 88 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 6272 |
| Total RAM Bits | 276480 |
| Number of LABs/CLBs | 392 |
| Number of CLBs | 392 |
| Height Seated (Max) | 1.65mm |
| Length | 20mm |
| Width | 20mm |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Cyclone® 10 LP |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
10CL006YE144C8G Overview
There is a 144-LQFP Exposed Pad package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 88 I/Os help it transfer data more efficiently. A fundamental building block consists of 6272 logic elements/cells. 1.2V volts power it. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.2V-volt supply voltage required for the device to operate. As part of the Cyclone? 10 LP series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is designed wFpga chipsh 144 terminations. As far as the RAM bits are concerned, this device offers you a total of 276480. Fpga electronics contains 392 LABs/CLBs in an array. 392 CLBs are basic modules used for its architecture.
10CL006YE144C8G Features
88 I/Os
Up to 276480 RAM bits
10CL006YE144C8G Applications
There are a lot of Intel 10CL006YE144C8G FPGAs applications.
- Automotive Applications
- Military Temperature
- Distributed Monetary Systems
- Artificial intelligence (AI)
- Development Boards and Shields for Microcontrollers
- High Performance Computing
- Consumer Electronics
- Defense Applications
- Radar and Sensors
- Security systems
