1106396-28
| Parameters | |
|---|---|
| Contact Material - Post | Brass |
| Packaging | Bulk |
| Published | 2006 |
| Series | Correct-A-Chip® 1106396 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Positions | 28 |
| Number of Rows | 2 |
| Additional Feature | SOCKET ADAPTER |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 3A |
| Pitch - Mating | 0.100 2.54mm |
| Lead Pitch | 2.54mm |
| Number of Contacts | 28 |
| Contact Finish - Post | Tin |
| PCB Contact Pattern | RECTANGULAR |
| Contact Style | RND PIN-SKT |
| Row Spacing | 7.62 mm |
| Device Socket Type | IC SOCKET |
| Termination Post Length | 0.130 3.30mm |
| Pitch - Post | 0.100 2.54mm |
| Convert From (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
| Convert To (Adapter End) | DIP, 0.6 (15.24mm) Row Spacing |
| Height | 2.29mm |
| Length | 35.6mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| Material Flammability Rating | UL94 V-0 |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Material | Copper |
| Contact Plating | Gold, Tin |
| Mounting Type | Through Hole |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Mating | Beryllium Copper |
See Relate Datesheet
