Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Copper |
Mounting Type | Through Hole |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Published | 2006 |
Series | Correct-A-Chip® 1107254 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Number of Positions | 28 |
Number of Rows | 2 |
Additional Feature | SOCKET ADAPTER |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 3A |
Pitch - Mating | 0.100 2.54mm |
Lead Pitch | 2.54mm |
Number of Contacts | 28 |
Contact Finish - Post | Tin |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.7 inch |
Body Depth | 0.3 inch |
Contact Style | RND PIN-SKT |
Row Spacing | 15.24 mm |
Device Socket Type | IC SOCKET |
Termination Post Length | 0.130 3.30mm |
Pitch - Post | 0.100 2.54mm |
Convert From (Adapter End) | DIP, 0.6 (15.24mm) Row Spacing |
Convert To (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
Height | 2.29mm |
Length | 35.6mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |