Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Package / Case | TO-8 |
Number of Pins | 8 |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Board Material | FR4 Epoxy Glass |
Published | 2007 |
Series | Correct-A-Chip® 1109523 |
JESD-609 Code | e0 |
Feature | Socket Included |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Additional Feature | STANDARD: UL 94V-0 |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 1A |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 8 |
Contact Finish - Post | Tin-Lead |
Device Socket Type | IC SOCKET |
Termination Post Length | 0.125 3.18mm |
Convert From (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
Convert To (Adapter End) | JEDEC |
Height | 5.85mm |
Length | 10.2mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |