Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Gold |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polyphenylene Sulfide (PPS) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -65°C~125°C |
Packaging | Bulk |
Published | 2006 |
Series | PLS |
Feature | Closed Frame |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | PGA, ZIF (ZIP) |
Number of Positions | 156 |
Max Operating Temperature | 125°C |
Min Operating Temperature | -65°C |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 1A |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Contact Finish - Post | Tin |
Lead Length | 3.175mm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |