Parameters | |
---|---|
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Packaging | Tube |
Published | 2012 |
Series | Diplomate DL |
JESD-609 Code | e3 |
Feature | Open Frame |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.6 (15.24mm) Row Spacing |
Color | Brown |
Number of Rows | 2 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Tin |
Orientation | Straight |
Pitch - Mating | 0.100 2.54mm |
Lead Pitch | 2.54mm |
Number of Contacts | 28 |
Contact Resistance | 30mOhm |
Insulation Resistance | 10GOhm |
ELV | Compliant |
Termination Post Length | 0.128 3.24mm |
Pitch - Post | 0.100 2.54mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Lead Free | Lead Free |