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2-382467-1

IC & Component Sockets 28P DIP HT TEMP BeCu


  • Manufacturer: TE Connectivity AMP Connectors
  • Nocochips NO: 792-2-382467-1
  • Package: -
  • Datasheet: PDF
  • Stock: 782
  • Description: IC & Component Sockets 28P DIP HT TEMP BeCu (Kg)

Details

Tags

Parameters
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Packaging Tube
Published 2012
Series Diplomate DL
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Color Brown
Number of Rows 2
HTS Code 8536.69.40.40
Contact Finish - Mating Tin
Orientation Straight
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 28
Contact Resistance 30mOhm
Insulation Resistance 10GOhm
ELV Compliant
Termination Post Length 0.128 3.24mm
Pitch - Post 0.100 2.54mm
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
See Relate Datesheet

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