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2199119-4

2199119-4 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Noco


  • Manufacturer: TE Connectivity AMP Connectors
  • Nocochips NO: 792-2199119-4
  • Package: -
  • Datasheet: PDF
  • Stock: 854
  • Description: 2199119-4 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from TE Connectivity AMP Connectors stock available at Noco(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact Material Copper Alloy
Contact Plating Gold, Tin
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Housing Material Thermoplastic
Material - Insulation Thermoplastic
PCB Mounting Orientation Right Angle
Operating Temperature -40°C~80°C
Packaging Tape & Reel (TR)
Published 2013
Feature Board Guide
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 67
Max Operating Temperature 80°C
Min Operating Temperature -40°C
Color Black
Number of Rows 2
Gender Female
Voltage - Rated 50V
Pitch 0.020 0.50mm
Orientation Right Angle
Current Rating 500mA
Contact Finish Gold
Number of Contacts 67
Housing Color Black
Operating Supply Voltage 50V
Card Type M.2 (NGFF) Mini Card
Read Out Dual
Insulation Resistance 500MOhm
Row Spacing 7.55 mm
ELV Compliant
Plating Gold
Sealable No
Contact Current Rating 500mA
Circuit Application Power
Height 3.2mm
Length 21.8948mm
Width 8.7mm
Contact Finish Thickness 15.0μin 0.38μm
REACH SVHC Unknown
RoHS Status RoHS Compliant

2199119-4 Overview


The material was packaged according to Tape & Reel (TR)'s specs.It's recommended to mount type Surface Mount, Right Angle.Currently, the device offers Board Guide features.An operating temperature of 80°C°C provides stable performance.If you want it to work reliably, it needs to be at -40°C degrees Celsius.

2199119-4 Features



2199119-4 Applications


There are a lot of TE Connectivity AMP Connectors 2199119-4 Edgeboard Connectors applications.

  • Imaging Systems
  • 3-phase power control
  • Digital beam-forming systems for ultrasound
  • Communication Systems
  • Broadband data applications
  • Multicarrier, multimode digital receivers
  • Multiplexed Data Acquisition Systems
  • Audio/Video devices
  • Music recording
  • Wireless local loop

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