Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Through Hole |
Package / Case | SOIC |
Number of Pins | 22 |
Material | FR4 Epoxy Glass |
Published | 2006 |
Series | Correct-A-Chip® 350000 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Number of Positions | 22 |
Pitch | 0.050 1.27mm |
Lead Length | 3.175mm |
Proto Board Type | SMD to DIP |
Board Thickness | 0.062 1.57mm 1/16 |
RoHS Status | Non-RoHS Compliant |