Parameters | |
---|---|
Board Material | FR4 Epoxy Glass |
Published | 2006 |
Series | Correct-A-Chip® 665000 |
JESD-609 Code | e0 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Pitch - Mating | 0.050 1.27mm |
Number of Contacts | 22 |
Contact Finish - Post | Tin-Lead |
Device Socket Type | IC SOCKET |
Termination Post Length | 0.031 0.80mm |
Pitch - Post | 0.050 1.27mm |
Convert From (Adapter End) | SOIC-W |
Convert To (Adapter End) | SOIC |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Number of Pins | 22 |
Contact Material - Post | Brass |