2327678-1
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 84 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327678-1 Overview
We packaged the material in accordance with Tape & Reel (TR)'s specifications.It's recommended you mount it type Surface Mount.This device is equipped with Board Guide, Pick and Place, Solder Retention features.Sliver 2.0 tells you what series the device is.
2327678-1 Features
Sliver 2.0 series
2327678-1 Applications
There are a lot of TE Connectivity AMP Connectors 2327678-1 Edgeboard Connectors applications.
- AC motor control
- Displaying
- Micro and pico cell systems, software radios
- Communications
- Multicarrier, multimode digital receivers
- High Speed Data Acquisition
- Smart antenna systems
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Digital Storage Oscilloscope
- Scientific instruments.
