Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Mounting Type |
Surface Mount, Right Angle |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Series |
Sliver 2.0 |
Feature |
Board Guide, Pick and Place, Solder Retention |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
Not Applicable |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
168 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Pitch |
0.024 0.60mm |
Contact Finish |
Gold-Palladium |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Number of Positions/Bay/Row |
28; 14; 28; 14 |
Contact Finish Thickness |
3.00μin 0.076μm |
Card Thickness |
0.062 1.57mm |
RoHS Status |
ROHS3 Compliant |
2336568-1 Overview
Tray wanted the material packaged as per his specs.It is recommended to mount the device using mounting type Surface Mount, Right Angle.The device is connected via the connector socket CARD EDGE CONNECTOR.This device is equipped with Board Guide, Pick and Place, Solder Retention features.Sliver 2.0 shows the device's series.
2336568-1 Features
Sliver 2.0 series
2336568-1 Applications
There are a lot of TE Connectivity AMP Connectors 2336568-1 Edgeboard Connectors applications.
- Micro and pico cell systems, software radios
- In-building wireless telephony
- Battery Operated Systems
- Smart antenna systems
- Imaging Systems
- Uninterrupted Power Supplies
- Telecommunications
- Multicarrier, multimode digital receivers
- Communication test equipment
- Industrial Process Control