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24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD


  • Manufacturer: Aries Electronics
  • Nocochips NO: 90-24-526-11
  • Package: -
  • Datasheet: PDF
  • Stock: 697
  • Description: CONN IC DIP SOCKET ZIF 24POS GLD (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Through Hole
Mounting Type Through Hole
Number of Pins 24
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2013
Series Lo-PRO®file, 526
JESD-609 Code e4
Feature Closed Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP)
Additional Feature STANDARD: UL 94V-0, LOW PROFILE
Contact Finish - Mating Gold
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Number of Contacts 24
Lead Length 2.667mm
Termination Post Length 0.105 2.67mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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