28-354000-20
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mounting Type | Surface Mount |
| Number of Pins | 28 |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Published | 2006 |
| Series | Correct-A-Chip® 354000 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Number of Rows | 2 |
| Additional Feature | STANDARD: UL 94V-0 |
| Contact Finish - Mating | Gold |
| Pitch | 2.54mm |
| Current Rating | 3A |
| Number of Contacts | 28 |
| Row Spacing | 7.62 mm |
| Device Socket Type | IC SOCKET |
| Pitch - Post | 0.100 2.54mm |
| Convert From (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
| Convert To (Adapter End) | SOIC |
| Height | 1.58mm |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Contact Finish Thickness - Post | 10.0μin 0.25μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
See Relate Datesheet
