3-1761465-4
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Number of Pins | 164 |
| Housing Material | Thermoplastic |
| Weight | 21.302g |
| Material - Insulation | Thermoplastic |
| PCB Mounting Orientation | Right Angle |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Published | 2008 |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Number of Positions | 164 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.039 1.00mm |
| Orientation | Right Angle |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Number of Contacts | 164 |
| Housing Color | Black |
| Lead Length | 3.0988mm |
| Operating Supply Voltage | 50V |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Termination Post Length | 3.1mm |
| Height | 9.4mm |
| Length | 89.0016mm |
| Width | 19.6mm |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Plating Thickness | 381 nm |
| Card Thickness | 0.062 1.57mm |
| PCB Thickness | 1.5748mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
3-1761465-4 Overview
As per Tray's specifications, the material was packaged.We recommend mounting type Through Hole, Right Angle.This device is equipped with Board Guide features.This allows stable operation up to 85°C°C.It needs a minimum working temperature of -40°C degrees Celsius.Make sure you have 164 pins.
3-1761465-4 Features
3-1761465-4 Applications
There are a lot of TE Connectivity AMP Connectors 3-1761465-4 Edgeboard Connectors applications.
- Battery Operated Systems
- In-building wireless telephony
- Micro and pico cell systems, software radios
- Audio/Video devices
- Scientific instruments.
- Handheld Terminal Interface
- Wireless and wired broadband communications
- Digital signal processing
- Multiplexed Data Acquisition Systems
- Scientific instruments
