Parameters | |
---|---|
Contact Material | Beryllium Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | SIP |
Contact Shape | Circular |
Insulation Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Housing Material | Polychlorinated |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2011 |
Series | 316 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Elevated Socket |
Number of Positions | 9 |
Number of Rows | 1 |
Gender | Female |
Additional Feature | SIP |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
Contact Type | Female Socket |
Orientation | Straight |
Depth | 2.54mm |
Insulation Height | 0.402 10.20mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Contact Length - Post | 0.118 3.00mm |
Number of Contacts | 9 |
Contact Finish - Post | Tin |
Housing Color | Black |
Contact Resistance | 10mOhm |
Max Voltage Rating (AC) | 100V |
Max Current Rating | 3A |
Device Socket Type | IC SOCKET |
Length | 22.86mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |