36-6553-11
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins (Grid) | 36 (2 x 18) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Packaging | Bulk |
| Published | 2013 |
| Series | 55 |
| JESD-609 Code | e4 |
| Feature | Closed Frame |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing |
| Additional Feature | STANDARD: UL 94V-0 |
| Contact Finish - Mating | Nickel Boron |
| Current Rating (Amps) | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 36 |
| Contact Finish - Post | Nickel Boron |
| Termination Post Length | 0.110 2.78mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 50.0μin 1.27μm |
| Contact Finish Thickness - Post | 50.0μin 1.27μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
