banner_page

397952

HMP 366 3% .022DIA. 23AWG


  • Manufacturer: Multicore
  • Nocochips NO: 339-397952
  • Package: -
  • Datasheet: PDF
  • Stock: 510
  • Description: HMP 366 3% .022DIA. 23AWG (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Weight 0.551lb 249.93g
Packaging Spool
Published 2000
Series 366
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Wire Solder
Composition Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Wire Gauge 23 AWG, 24 SWG
Wire/Cable Gauge 23 AWG
Form Spool, 8.8 oz (250g)
Process Leaded
Melting Point 565°F~574°F 296°C~301°C
Flux Type Rosin Activated (RA)
Diameter 0.022 0.56mm
RoHS Status Non-RoHS Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good