Parameters | |
---|---|
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Number of Pins | 44 |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Phosphor Bronze |
Packaging | Bulk |
Published | 2002 |
Series | 647 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Additional Feature | UL 94V-0 |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 3A |
Number of Contacts | 44 |
Contact Finish - Post | Tin |
Device Socket Type | IC SOCKET |
Termination Post Length | 0.180 4.57mm |
Convert From (Adapter End) | SOIC |
Convert To (Adapter End) | DIP, 0.6 (15.24mm) Row Spacing |
Height | 2.39mm |
Length | 69.9mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | Non-RoHS Compliant |