4860P-500G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Published | 2016 |
| Series | 4860 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Paste |
| Composition | Sn63Pb37 (63/37) |
| Shelf Life | 24 Months |
| Storage/Refrigeration Temperature | 35°F~50°F 2°C~10°C |
| Shelf Life Start | Date of Manufacture |
| Form | Jar, 17.64 oz (500g) |
| Process | Leaded |
| Melting Point | 361°F 183°C |
| Flux Type | No-Clean |
See Relate Datesheet
