Parameters | |
---|---|
Factory Lead Time | 1 Week |
Weight | 25g |
Packaging | Syringe |
Published | 2014 |
Series | 4900 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Shelf Life | 24 Months |
Storage/Refrigeration Temperature | 35°F~50°F 2°C~10°C |
Shelf Life Start | Date of Manufacture |
Form | Syringe, 0.88 oz (25g) |
Process | Lead Free |
Melting Point | 423°F~430°F 217°C~221°C |
Flux Type | No-Clean |
RoHS Status | ROHS3 Compliant |