6364666-2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Polyester |
| Material - Insulation | Polyester, Glass Filled |
| Underplate Material | Nickel |
| Operating Temperature | -55°C~ 85°C |
| Packaging | Bulk |
| Published | 2001 |
| Series | Standard Edge II |
| Feature | Latches |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Socket |
| Number of Positions | 25 (24 Loaded) |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Voltage - Rated | 400V |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.100 2.54mm |
| Orientation | Vertical |
| Contact Finish | Gold |
| Number of Contacts | 50 |
| Operating Supply Voltage | 400V |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Row Spacing | 4.85 mm |
| ELV | Compliant |
| Max Current Rating | 4.26A |
| Contact Current Rating | 4.26A |
| Circuit Application | Power |
| Height | 19.05mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 760 nm |
| Card Thickness | 0.054 ~ 0.070 1.37mm ~ 1.78mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
6364666-2 Overview
It was packaged based on Bulk's specs.It is recommended that you mount the device with mounting type Through Hole.Devices are connected to the computer using the connector socket Socket.A device with Latches features is available.Standard Edge II indicates the device's series number.
6364666-2 Features
Standard Edge II series
6364666-2 Applications
There are a lot of TE Connectivity AMP Connectors 6364666-2 Edgeboard Connectors applications.
- Multiplexed Data Acquisition Systems
- Communications
- Communication test equipment
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Battery Operated Systems
- Scientific instruments.
- Telecommunications
- In-building wireless telephony
- CMOS Image sensors for mobile applications
- Cell Phones
