7-1734774-0
| Parameters | |
|---|---|
| Weight | 5.499807g |
| Material - Insulation | Polyamide (PA46), Nylon 4/6 |
| PCB Mounting Orientation | Vertical |
| Published | 2011 |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Color | White |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Vertical |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Number of Contacts | 98 |
| Housing Color | White |
| Lead Length | 3.0988mm |
| Operating Supply Voltage | 50V |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Termination Post Length | 3.1mm |
| Height | 10.0076mm |
| Length | 56.007mm |
| Width | 8.7884mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 2.54μm |
| Card Thickness | 0.062 1.57mm |
| PCB Thickness | 1.5748mm |
| RoHS Status | RoHS Compliant |
| Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
| Contact Material | Phosphor Bronze - Tin Plated |
| Contact Plating | Gold, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Number of Pins | 98 |
7-1734774-0 Overview
There is a recommendation for mounting type Through Hole.In addition to the device's features, it has Board Guide, Locking Ramp.Stable operation can be achieved at a maximum temperature of 85°C°C.It needs to work at a minimum of -40°C degrees Celsius.For this device to work, there are 98 pins required.
7-1734774-0 Features
7-1734774-0 Applications
There are a lot of TE Connectivity AMP Connectors 7-1734774-0 Edgeboard Connectors applications.
- High Speed Data Acquisition for PCs
- TD-SCDMA, WiMAX
- Communication Systems
- Scientific instruments
- Communication test equipment
- Music recording
- In-building wireless telephony
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Multiplexed Data Acquisition Systems
- Microcontrollers.
