70-2102-0510
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Weight | 1.1lbs 499g |
| Packaging | Jar |
| Published | 2004 |
| Series | R562 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Paste |
| Composition | Sn63Pb37 (63/37) |
| Shelf Life | 6 Months |
| Storage/Refrigeration Temperature | 32°F~50°F 0°C~10°C |
| Shelf Life Start | Date of Manufacture |
| Form | Jar, 17.64 oz (500g) |
| Process | Leaded |
| Melting Point | 361°F 183°C |
| Flux Type | Water Soluble |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
