Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | TO-263 |
Material | Copper |
Shape | Rectangular, Fins |
Package Cooled | TO-263 (D2Pak) |
Material Finish | Tin |
Published | 2006 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |
Color | Black |
Depth | 19.38mm |
Attachment Method | SMD Pad |
Height Off Base (Height of Fin) | 0.450 11.43mm |
Thermal Resistance @ Forced Air Flow | 3.00°C/W @ 300 LFM |
Thermal Resistance @ Natural | 11.00°C/W |
Power Dissipation @ Temperature Rise | 2.0W @ 30°C |
Height | 11mm |
Length | 0.763 19.38mm |
Width | 1.000 25.40mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |