Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
LQFP |
Number of Pins |
120 |
Packaging |
Tape & Reel |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Operating Supply Voltage |
5V |
Number of Circuits |
1 |
Max Supply Voltage |
5.5V |
Min Supply Voltage |
4.5V |
Memory Size |
9kB |
Element Configuration |
Dual |
Max Supply Current |
400μA |
Frequency (Max) |
50MHz |
Access Time |
13 ns |
Data Bus Width |
36b |
Direction |
Bidirectional |
Bus Directional |
Bidirectional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Length |
14mm |
Width |
14mm |
Thickness |
1.4mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
723651L20PFGI8 Overview
FIFO memory chip is contained in the LQFP package.You'll find it packaged in the shape of a Tape & Reel .A FIFO chip's memory is 9kB , which may be used to store applications and data.Surface Mount is memory IC's recommended mounting method.The operation pins are 120 pins.In order for FIFO design to operate, FIFO design requires a maximum current of 400μA .FIFO is recommended that the supply voltage be set to 5V in order to maximize efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of -40°C degrees Celsius.Keeping the operating temperature at 85°C °C allows the FIFO products to operate continuously.It is possible to operate the FIFO memory chip at very low supply voltages, such as 4.5V volts.A maximum supply voltage of 5.5V V can be handled by this FIFO memory chip.50MHz is the FIFO memory IC's maximum value for regular operation.Using 1 circuits gives FIFO memory chip enhanced flexibility.
723651L20PFGI8 Features
9kB memory size
Frequency at most
723651L20PFGI8 Applications
There are a lot of Integrated Device Technology (IDT) 723651L20PFGI8 FIFOs Memory applications.
- Measurement Equipment
- Battery Charger
- Network switching/routing
- Disk Controllers
- Communications Systems
- Thermal Management for DDR3 Memory Modules
- Microprogramming
- Test Equipment
- Cardiac Monitoring Device
- General Data Collection Applications at Extreme High-Temperatures