Parameters |
Mounting Type |
Through Hole |
Package / Case |
16-DIP (0.300, 7.62mm) |
Surface Mount |
NO |
Operating Temperature |
-40°C~125°C |
Packaging |
Tube |
Published |
1997 |
Series |
74HCT |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
16 |
Terminal Finish |
NICKEL PALLADIUM GOLD |
Subcategory |
Other Memory ICs |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
5V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
74HCT670 |
Function |
Universal |
Qualification Status |
Not Qualified |
Output Type |
Tri-State |
Number of Elements |
1 |
Supply Voltage-Max (Vsup) |
5.5V |
Power Supplies |
5V |
Number of Ports |
1 |
Operating Mode |
ASYNCHRONOUS |
Organization |
4X4 |
Output Characteristics |
3-STATE |
Logic Type |
Register File |
Memory Width |
4 |
Number of Bits per Element |
4 |
Access Time (Max) |
60 ns |
Parallel/Serial |
PARALLEL |
Memory IC Type |
STANDARD SRAM |
Output Enable |
NO |
Width |
7.62mm |
RoHS Status |
ROHS3 Compliant |
74HCT670N,652 Overview
There is a 16-DIP (0.300, 7.62mm) package embedded with the device. 16 is the total number of terminations on the chip. It is used to pack in Tube case. Its operating supply voltage is rated at 5V. 1 elements make up this part. There is a component mounted in the way of Through Hole on this board. The operating temperature ranges -40°C~125°C. The voltage supplied to it is within the range of 4.5V~5.5V. The 74HCT series contains this electrical component. Search for similar parts based on the 74HCT670 family. A device capable of delivering voltage at 5V can be used. The maximum supply voltage (Vsup) for this part should not be more than 5.5V. Other Memory ICs is its subcategory.
74HCT670N,652 Features
Mounted in Through Hole type.
Based on 74HCT670 family
It supplies 5V power
74HCT670N,652 Applications
There are a lot of NXP USA Inc. 74HCT670N,652 Shift Registers applications.
- ROM Chips
- Serial-to-parallel data conversion
- Generate time delay toward digital circuits
- Flash Memory
- Output expansion
- Pulse Extenders
- data manipulation
- Parallel to serial converter
- Data Format Converters
- Delay Line