Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | Nonstandard Chip |
Operating Temperature | -55°C~150°C |
Packaging | Tray |
Series | WLSC |
Size / Dimension | 0.012Lx0.012W 0.29mmx0.29mm |
Tolerance | ±15% |
Feature | High Reliability, Low Profile |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Applications | High Stability, Vertical Silicon Cap, Wirebond |
Capacitance | 1nF |
ESR (Equivalent Series Resistance) | 50mOhm |
Voltage - Breakdown | 50V |
ESL (Equivalent Series Inductance) | 50pH |
Height | 0.005 0.12mm |
RoHS Status | ROHS3 Compliant |